Apple Silicon 結果共3筆

Taiwan Semiconductor Manufacturing Company (TSMC) predicts a surge in artificial intelligence (AI) orders in the coming year, with October’s revenue reaching NT$243.203 billion ($8.6 billion), a 34.8 percent monthly increase and a 15.7 percent annual increase. TSMC’s stock price has also been on a steady rise, accumulating a growth of 7.5 percent since November. Morgan Stanley semiconductor research analyst Charlie Chan attributes TSMC’s revenue growth to signs of recovery and the robust demand for AI semiconductors worldwide. NVIDIA’s expanded order to TSMC, along with increased demand from clients like Apple and Advanced Micro Devices (AMD), has led TSMC to accelerate the enhancement of its advanced packaging technology, Chip on Wafer on Substrate (CoWoS). CoWoS enables TSMC to effectively reduce costs and trim electric consumption by packaging chiplets on a silicon interposer and placing them on a package substrate. However, TSMC’s current CoWoS capacity remains a bottleneck for NVIDIA’s AI GPU chips, though the company forecasts a rebound in productivity by the end of 2024 to meet customer demand.

蘋果在日前舉行的WWDC 23發表多款新品，其中包含全新Mac Pro，台灣售價自229900元起，頂規版本則突破40萬元，然而此次Mac Pro卻不開放用戶自行升級GPU顯卡，另外記憶體就算選滿也只有192GB，引發外界質疑規格是否「縮水」。

蘋果（Apple）擴大自製晶片，繼電腦用Apple Silicon處理器後，市場傳出蘋果將採用台積電5奈米生產繪圖處理器（GPU），激勵台積電股價一度漲逾1%。